Key Benefits

  • Bio-compatible (lead free)
  • Fine pitch process (50 micron pad gaps) without additional patterning for individual I/O pads bonding during chip assembly
  • Low temperature process (as low as 70°C)
  • Eliminates the need for underfill in flip chip bonding
  • Provides excellent thermal conductivity (> 4.5 W/mK) across the entire bond surface
  • Small bond thickness (as low as 15 microns)

ADVANTAGES OVER ANISOTROPIC CONDUCTIVE FILMS (ACFs)

  • Bump processing not required
  • Pressure free. No risk of mechanical damage to sensitive substrates
Our ZTACH™ adhesives are RoHS compliant and have been used for nearly 10 years without any failures in the field.