Next Generation Electronic Assembly Materials
SunRay Scientific’s ZTACH® ACE and ZMAG® Magnetic Pallet Interconnect Solution is a pressure-less, pattern-less Z-axis, conductive adhesive technology for fine-feature assembly on existing SMT manufacturing lines.
ZTACH® ACE and ZMAG® Magnetic Pallet Interconnect Solution
Traditional Interconnect Solutions
- Low bond strength
- Requires patterning or thermal bonding
- Brittle/inflexible
- Higher process temperatures & longer process times
- Require secondary materials (encapulation or underfill)
- Extremely high conductive particle loading
- Constricted throughput
The ZTACH®ACE Interconnect Solution
Enabled by the innovation of our ZMAG® Magnetic Pallet, ZTACH® ACE achieves z-axis particle alignment within 10 seconds to create an anisotropic electrical and mechanical bond between component and circuit. This technology enables the ability to displace traditional electrical interconnect solutions with greater performance and reliability.
Technology Advantages
- Fine-pitch interconnections down to 100um
- 5-10x increase in bond strength
- No patterning or pressure required
- Reduced cost through low conductive particle loading
- Contact resistance between 7-20 mOh-cm
- Low temperature and UV cure options
- Broad substrate compatibility
- Easily adaptable into most SMT manufacturing lines
Advanced Engineering Services
- Product design and prototype development support to help you integrate ZTACH® ACE into your products and process
- Manufacturing to scale process development
- Ability to customize process and formulations to address specific application requirements
Our Complementary Technologies
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Our unique manufacturing process and proprietary additive technology have led to the development of an innovative family of conductive silver-based inks which achieve much lower conductivity with less silver content, while drastically reducing oxide formation and the silver migration that stems from it. This results in: creased conductivity with less silver content.
Conductive
Silver Inks
- Elasticity to 100% with less than a 10% change in resistance
- 20% increase in flexibility over competitively tested products
- Equal to or less than 10% increase in resistance after 85C/85RH testing
- 15-20% reduction in silver for matched conductivity of competitive materials
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Utilizing the same innovative manufacturing process for our adhesive technology allows SunRay’s electrically conductive epoxies to achieve similar advantages in improved conductivity with much lower silver content. This also allows for dramatically increased adhesion.
Silver Filled
Epoxy Adhesive
- 2 -3 x improvement in bond strength
- 10-20% decrease in contact resistance
- Improved processing, ~140C for 3 minutes
-
15-20% reduction in silver for matched conductivity of competitive materials
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SunRay Scientific has developed an innovative, fully compatible family of device encapsulation and dielectric protection materials to enable more durable, reliable protection for your printed electronic applications.
UV Cured
Protective Materials
- TPU compatible dielectric inks
- Tensile strength of 120 PSI at 24C
- Increased dielectric strength and 975V at 25um voltage breakdown protection
-
Moisture resistance less than 1% uptake at 24 hour submersion
Current Markets & Applications
Flexible TPU with LED - Durability Testing
Material Science Insights
What does SunRay Scientific do, and how is it positioned in the advanced materials market?
SunRay Scientific is a U.S.-based advanced materials manufacturer specializing in anisotropic conductive adhesives, conductive inks, silver epoxies, and encapsulants for printed electronics, semiconductor packaging, wearable electronics, and industrial applications. With patented ZTACH® ACE technology and over 20 years of expertise, SunRay Scientific delivers application-ready interconnect solutions that reduce time-to-market for global electronics manufacturers and R&D innovators.
Advanced materials engineered for real-world applications
SunRay Scientific is a trusted manufacturer of printed electronics materials and functional inks designed for high-performance industrial, medical, automotive, and sensor applications. We specialize in application-ready solutions that help manufacturers accelerate development, reduce time-to-market, and scale production with confidence using precision-engineered conductive and functional materials.
- Advanced printed electronics and material science manufacturing expertise
- Application-driven development for sensors, instrumentation, and smart systems
- Proven quality, reliability, and performance across industrial environments
- Global research partnerships supporting scalable commercial production
Vision & Mission
SunRay Scientific is a global materials technology company specializing in unique and novel anisotropic conductive adhesive materials, conductive inks, epoxies, and encapsulants.
Our technology innovations enable lighter, smaller, less costly electronics with improved manufacturing throughput & increased reliability. Our mission is to provide our partners with innovative, value-added solutions to meet their complex printed electronics and electrical interconnect needs.