Medical Device Applications
Precision Interconnects for the Next Generation of Medical Devices
Material Solutions By Application
Ultra-Fine Wire & Microribbon Attachment
Microwires in catheters and neurostim leads have extremely small diameters, creating massive hurdles for reliable electrical interconnections.
SunRay’s Solution: ZTACH® ACE enables sub-micron bonding on ultra-fine pitches, ensuring signal integrity in the smallest medical footprints.
Wearable
Biosensors
Stretchable and conformal substrates are difficult to apply circuitry to and bond components due to both mechanical stress and processing limitations.
SunRay’s Solution: StretchS™ stretchable conductive inks are designed to bond seamlessly with TPU substrates and ZTACH® ACE is designed to bond with high strain relief at low temperature to those same substrates.
Medical
Electronics
The need for increased performance in less space without sacrifice to reliability is critical.
SunRay’s Solution: ZTACH® ACE fine pitch anisotropic interconnection with high mechanical and environmental reliability enables further miniaturization for high performance component attach.
ZTACH® ACE Case Study for Microwire Attach
Critical assembly processes for high-density, high-performance electronics
- Pressure-less attach minimizes wire sweep, bending, breaking or displacement from intended position
- Fine pitch down to 100μm
- Provides full encapsulation
- 4x improvement in bond strength
- Encasing wire & sheathing provides strain relief
- No overheating of wire sheathing or metal pad peeling off substrate
- Average of 80% reduction in manufacturing cycle time with UV ZTACH®ACE
Conductive Flex Silver Paste for Catheter Assemblies
SunRay improves the reliability of catheter interconnects by providing a mechanically robust, easily manufactured connection that maintains signal integrity and supports efficient, repeatable production.
- Conventional two-part epoxies can crack, lose signal integrity, and degrade under repeated flexing and micro-motion
- Flexible conductive silver paste resists cracking and delamination, flexibility under repeated bending
- Single-component formulation eliminates mixing and pot-life limitations
- Supports stable, low-noise transmission of low-amplitude bioelectrical signals
- Cure within minutes at temperature below 120C improves manufacturing efficiency and consistency
- Strong adhesion to copper conductors and catheter polymer materials
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